Products of and method for improving adhesion between substrate and polymer layers
US6416613B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1998 |
| Grant date | Jul 9, 2002 |
| Priority date | — |
| Expiry date | Jun 23, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2038/0076
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method for improving both adhesion between substrate and polymer layers and the durability of such composite structures; while maintaining the malleability and preferred characteristics of the original substrate. Quite unexpectedly, the application of a layer or film upon an uncured, encapsulated base substrate which has been encapsulated by the shear thinning methods of the present invention, results in superior adhesion of multiple layers when compared to conventional layering, coating or composite manufacturing methods. Moreover, the uncured or at most, semi-cured, polymer composition applied to the base substrate ensures that the substrate maintains maximum flexibility for subsequent shaping into composite articles prior to curing. The methods described herein produce multiple layer composite articles that are lighter, stronger, more flexible and utilize less material, than composite articles produced by conventional techniques. The method comprises applying an uncured, substantially solvent free, polymer composition exhibiting thixotropic or pseudoplastic characteristics, onto a base substrate having structural elements and interstices thereb…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.