Method for anodic bonding
US6417478B1 · kind B1 · utility
6Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Jul 9, 2002 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0004
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member 10 having a bonding film 11 on a bonding surface and a second member 12 closely put on the bonding surface of the first member 10 through the bonding film 11 in a manner that the first member 10 is rendered as an anode, characterized in that: the bonding film 11 is of a metal film and the second member 12 is of a soda-lime glass, and a bonding temperature is at 100-200° C. and an application voltage is at 0.5-5.0 kV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.