CPU cooling device with a mounting mechanism
US6419008B1 · kind B1 · utility
7Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2001 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Nov 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A CPU cooling device with a mounting mechanism has at least one pair of wedge members. The wedge member has a positioning end for passing through a through hole of a vertical plate, a protruding block, a snapping plate for retaining a fixing frame by means of engagement of a distal snapping end on the snapping plate and a flange of the fixing frame, and an embedding plate for locking a radiator by inserting the embedding plate into a groove on a ledge of the radiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.