Process and apparatus for polishing a workpiece
US6419555B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material, preferably having an elasticity modulus of from 1.0 to 8×104 N/mm2. The plastic material is preferably secured to the carrier disk by a layer of adhesive positioned parallel to a surface of the carrier disk. In particular, the plastic material is laminated into the carrier disk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.