Method of polishing using a polishing pad
US6419556B1 · kind B1 · utility
16Cited by
34References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polishing pad for polishing hard surfaces such as glass and silicon wafers and a method of polishing using such a polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.