Structuring device for processing a substrate

US6419752B1 · kind B1 · utility

Assignees

• THE PROVOST, FELLOWS AND SCHOLARS OF THE COLLEGE OF THE HOLY AND UNDIVIDED TRINITY OF QUEEN ELIZABETH NEAR DUBLIN · IE
• Universitat Gesamthochschule Kassel · DE
• IMS-Ionen Mikrofabrikationas Systeme · AT

Inventors

• Igor Shvets · Castleknock, IE
• Ivajlo Rangelow · Kassel, DE
• Peter Güthner · Taunusstein, DE
• Jens Voight · Vellmar, DE
• Guido Mariotto · Dublin, IE
• Hans Loschner · Wien, AT

Key dates

• Filing date: Sep 17, 1999
• Grant date: Jul 16, 2002
• Expiry date: Sep 17, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/3321
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A structuring device (SD) for processing a surface of a substrate (SB), comprising a substrate chamber (VC) for mounting the substrate (SB) and a reaction chamber (GC) enabling a gas reaction at a given operating pressure. The reaction chamber (GC) has at least one gas inlet (GL) for a reaction gas and at least one injection outlet (JL) leading into the substrate chamber, while the substrate chamber (VC) is provided with a pumping system (PP) for maintaining a vacuum within the substrate chamber at a pressure not above the operating pressure of the gas reaction in the reaction chamber (GC). The injection outlet (JL) is provided with at least one injection pipe ending into an injection opening of given width, the injection pipe having a length not smaller than the width of the injection opening, the injection pipe forming the gas particles originating from the gas reaction into a gas jet streaming out of the injection opening. For controlling the distance between the injection opening and the substrate surface (SB) at a height of the order of or below the width of the opening as measured along the axis of the injection pipe, the injection outlet and/or the substrate are provided wit…