Multilayer structure comprising a material covered with a copolymer having polyamide blocks and hydrophilic blocks
US6420045B1 · kind B1 · utility
15Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Jun 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31783
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a multilayer structure comprising a material covered with a copolymer having polyamide blocks and hydrophilic blocks where the copolymer has a melting point of less than 135° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.