Method of manufacturing electronic stripline components
US6420096B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Apr 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention describes a method of manufacturing an electronic thin-film component comprising at least one stripline. In this method, first a metallic base layer is deposited on a substrate layer, a photoresist layer is applied to this metallic base layer, and structured in accordance with the stripline(s) to be formed. An electroconductive layer is deposited on the exposed regions of the metallic base layer. Subsequently, the photoresist is removed and the metallic base layer is etched. This method has the advantage that less metal is required as compared to other thin-film methods. Overlapping areas of the striplines can be formed readily, economically, and with small current capacitances by means of bridges. By means of the method described herein, passive components, such as thin-film couplers for high-frequency applications or thin-film coils can be readily obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.