Semiconductor device and method for manufacturing the same
US6420210B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Mar 19, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, a dielectric tape layer and a printed circuit board. The semiconductor chip has a pad mounting surface with a plurality of bonding pads provided thereon. The dielectric tape layer has opposite first and second adhesive surfaces. The first adhesive surface is adhered onto the pad mounting surface of the semiconductor chip. The dielectric tape layer is formed with a plurality of holes at positions registered with the bonding pads to expose the bonding pads. Each of the holes is confined by a wall that cooperates with a registered one of the bonding pads to form a contact receiving space. A plurality of conductive contacts are placed in the contact receiving spaces, respectively. The printed circuit board has a circuit layout surface adhered onto the second adhesive surface of the dielectric tape layer. The circuit layout surface is formed with circuit traces that are bonded to the conductive contacts to establish electrical connection with the bonding pads. A method for manufacturing the semiconductor device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.