Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom
US6420476B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 16, 1999 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Apr 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.