Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
US6420664B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1999 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Nov 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device characterized in that: a circuit substrate of a single or multiple layer which is composed in such a manner that, bumps, which are electrically connected to connection electrodes provided on one face of a surface mount device, are arranged in the same plane arrangement as that of said connection electrodes and protruded onto one side of a sheet of metal foil, on which wiring patterns electrically connected to said bumps with each other are formed, and an insulating adhesive agent layer is made to adhere onto the one side of a sheet of metal foil having bumps, is made to adhere onto one face of the surface mount device by said insulating adhesive agent layer; and tips of the bumps respectively come into contact with the connection electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.