Method for separating non-metallic substrates
US6420678B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Jan 29, 1999 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Jan 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for physically separating non-metallic substrates by forming a microcrack in the substrate and controllingly propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate between its top and bottom surfaces. A scribe beam is applied onto the substrate on a separation line. A helium coolant stream intersects with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate. A preheat beam preheats the heat affected area on the substrate. The beams are formed by an arrangement of lasers and mirrors and lenses. A movable mirror selectively diverts a beam to form either the preheat beam or one or more of the break and scribe be…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.