Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
US6420788B1 · kind B1 · utility
7Cited by
5References
9Claims
0Family size
Inventor
Key dates
| Filing date | Oct 16, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Oct 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an insulative isolating layer on the pad-mounting surface, and forming a conductive body in the insulative isolating layer. The isolating layer has a contact receiving cavity, and an access hole for access to the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductive body has an anchor portion filling the contact receiving cavity and the access hole and connecting electrically with the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.