Integral heat dissipating device
US6421239B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Jul 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integral heat dissipating device includes a radiating plate, a fan blade and a cover. The radiating plate has a heat dissipating channel. A fan blade receiving chamber is communicated with the heat dissipating channel and a heat conductive plate is connected to the bottom of the outer wall of the heat dissipating channel. The bottom of the fan blade receiving chamber is installed with an axial hole which serves to be installed with a fan blade. The axial hole can be installed with a fan blade with power. An inclined surface is formed at the upper side of the fan blade receiving chamber. A plate shape heat tube is welded between the heat conductive plate and the bottom of the heat dissipating channel. A plurality of screw retaining posts capable of being screwedly fixed to a circuit board being suspended from the lateral side of the heat conductive plate. The cover is a thin plate with a hole for sealing the upper side of the heat dissipating channel and the fan blade receiving chamber. The hole is placed above the fan blade receiving chamber for being formed as a tilt wind opening. In the present invention, the radiating plate is made integrally and can be directly connected to …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.