High throughput interconnection system using orthogonal connectors
US6422876B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/716
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention is a method and apparatus for interconnection system. A first front connector is located at a side of a first front card to provide first contacts for first signal traces on the first front card. A second front connector located at a side of a second front card to provide second contacts for second signal traces on the second front card. A mating connector has first and second receptacles and is located alongside of a rear card. The mating connector electrically connects the first contacts of the first signal traces to the second contacts of the second signal traces via contacts in the first and second receptacles. The first and second receptacles couple to the first and second front connectors, respectively. The rear card is positioned in a substantially orthogonal direction to the first and second front cards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.