Apparatus and method for forming a bonding on a tapered part
US6423371B1 · kind B1 · utility
9Cited by
13References
57Claims
0Family size
Inventor
Key dates
| Filing date | Feb 13, 2001 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Feb 13, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a bonding on a tapered surface of a wall of a part to substantially eliminate the tapered surface. The method includes positioning the part and a sprayer at a predetermined distance, supplying a bonding material to the sprayer, and applying differing amounts of the bonding material from the sprayer to the tapered surface of the wall of the part to change the tapered surface of the wall of the part to a substantially non-tapered surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.