Method for manufacture of electronic parts
US6423456B1 · kind B1 · utility
2Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2001 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Apr 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by patternwise delivery of heat, comprises a polymer of general formula (I), wherein R1 represents a hydrogen atom or alkyl group, R2 represents a hydrogen atom or alkyl group, R3 represents a hydrogen atom or alkyl group, and R4 represents hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.