Integrated electronic circuit comprising at least an electronic power component
US6423573B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Apr 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an integrated circuit having a plurality of electronic components by the steps of:a) forming plurality of components with connection points in a substrate plate;b) forming a connection support of conducting tracks;c) transferring the substrate plate onto the connection support connecting the connection points with the conducting tracks;d) forming at least one separation trench in the substrate plate, surrounding a portion of substrate having at least one electronic component, in a way that separates it from the other components in the plate; ande) filling the trenches with a dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.