Method for reducing an electrical noise inside a ball grid array package
US6423577B1 · kind B1 · utility
2Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | May 2, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for reducing electrical noise inside a ball grid array package for installing capacitors between a plurality of power pads and ground pads on a top side of a substrate of the ball grid array package coats solder paste on the plurality of power pads and ground pads, coats adhesive glue beneath the plurality of capacitors, fixes the plurality of capacitors on the power pads and ground pads with the adhesive glue and solder paste, and solidifies the adhesive glue in a reflow soldering stove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.