Surface mount package for long lead devices
US6423906B2 · kind B2 · utility
4Cited by
12References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Sep 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10765
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.