Micro soldering method and apparatus
US6423939B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 2, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Oct 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus having a heating circuit including a resistor layer and a patterned conductor layer is disclosed. The pattern defines a current path that includes at least one portion of the resistor layer. When current is applied to the current path, heat is generated in the portion of the resistor layer that is a part of the current path. The heat is used to reflow solder to connect two components such as an integrated circuit chip (IC) to a multi-chip module (MCM) module. This localized electric heating method may be used to package multiple chips on a module. The apparatus having the heating circuit may be fabricated by first depositing a resistor layer on to a substrate. Then, a conductor layer is deposited and etched to define the current path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.