Patent · US Expired

Probe and test socket assembly

US6424166B1 · kind B1 · utility

20Cited by

7References

1Claims

0Family size

Inventors

David Henry · Platte City, US
William E. Thurston · Kansas City, US
Timothy W. Dowdle · Overland Park, US

Key dates

Filing date	Jul 14, 2000
Grant date	Jul 23, 2002
Priority date	—
Expiry date	Jul 14, 2020

Classification

Technology area (CPC G)Physics
CPC primaryG01R1/0466
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe and test socket assembly wherein spring biased plunger probes of extraordinarily small diameter, such as 0.02 inch, are densely packed into a test socket for testing of integrated circuit chips. The socket is constructed in upper and lower halves with bores to receive the probes. To manufacture probes of such small diameter and to provide minimal and constant electrical resistance, the plungers and barrel of the probes are not crimped or otherwise secured together. The configuration of the socket bore walls in combination with the probe maintains the probe plunger and barrel together. The assembly is particularly useful in densely packed arrays of extremely fine diameter probes for testing densely packed test sites.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.