MMIC power amplifier with wirebond output matching circuit
US6424223B1 · kind B1 · utility
25Cited by
11References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2001 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Jan 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid microwave and millimeter wave integrated circuit (MMIC) RF power amplifier includes an integrated circuit in which an amplifier circuit is fabricated and an output impedance matching network comprising metal-insulator-metal (MIM) capacitors mounted on the integrated circuit chip with bonding wire inductors connecting the amplifier circuit with the capacitor elements. The resulting structure has a smaller form factor as compared to conventional power amplifiers employing planar transmission lines and surface mount technology capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.