Method and apparatus for micro BGA removal and reattach
US6425515B2 · kind B2 · utility
7Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2001 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Feb 1, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for attaching an electronic device to and removing an electronic device from a substrate includes verifying a position of a pick-up and vacuum head relative to the electronic device prior to contacting the electronic device with the pick-up and vacuum head; contacting the electronic device with a device for conductively applying heat to the electronic device and picking up the electronic device; and heating solder for attaching the electronic device to the substrate to a reflow temperature of the solder by applying heat to the device for conductively applying heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.