Optical module and method of manufacturing the same
US6425695B1 · kind B1 · utility
7Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Apr 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A surface emission laser (14) is disposed so that a side surface (15) of a semiconductor substrate of the surface emission laser (14) faces a plane (13) of a mounting substrate (12). By this means, emitted light (44) from the surface emission laser (14) travels in the direction along the plane (13) of the mounting substrate (12). Therefore, it is possible to dispose the optical fiber (16) so as to be along the plane (13) of the mounting substrate (12). By this means, an optical module (10) can be made thinner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.