IC socket
US6425771B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC socket is provided which can absorb the difference in linear expansion coefficient between the housing and the circuit board, and thus prevent the occurrence of solder cracking and warping, without lowering the strength of the housing. First slits which have bottoms and which extend from the upper surface of the housing toward the undersurface of the housing are formed between specified rows of pin receiving openings which are formed in the upper surfaces of contact press-fitting accommodating holes that are arranged in the form of a matrix. These holes pass entirely through the housing from the upper surface to the undersurface. Second slits which have bottoms and which extend from the undersurface of the housing toward the upper surface of the housing are formed between specified rows of solder ball receiving cavities formed in the undersurfaces of the contact receiving cavities in positions where the first slits are not formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.