Water bath and method for electrolytic deposition of copper coatings

US6425996B1 · kind B1 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Wolfgang Dahms · Berlin, DE
• Michael Jonat · Falkensee, DE
• Gerd Senge · Berlin, DE
• Detley Nitsche · Berlin, DE

Key dates

• Filing date: Jul 28, 2000
• Grant date: Jul 30, 2002
• Expiry date: Jul 28, 2020

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G73/0286
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conductivity of the deposition bath as well as at least one additive, at least one transformation product, formed from epihalohydrins, dihalohydrins or respectively 1-halogen-2,3-propanediols and polyamidoamines being contained as the additive. The polyamidoamines are formed by the condensation reaction of dicarboxylic acids with polyalkylene polyamines. When copper coatings are deposited from this bath, copper layers of uniform layer thickness can be deposited.