Etchant for copper or copper alloys
US6426020B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Nov 9, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etchant for copper or copper alloys comprising 5-50 wt % of an alkanolamine, a copper ion source in the amount of 0.2-10 wt % as copper, a halide ion source in the amount of 0.005-10 wt % as halogen, 0.1-30 wt % of an aliphatic carboxylic acid, and the balance water, wherein the molar ratio of the alkanolamine to one mol of the aliphatic carboxylic acid is two or more. The etchant is free from problems such as instability of the liquid composition and unpleasant odor, has a high etching rate, exhibits only very slight corrosion even if a small amount of residue is left on the surface and is capable of producing a roughened surface when used for microetching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.