Adhesive film for electronic parts
US6426138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1999 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Aug 13, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2887
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an adhesive film for electronic parts, for example, an adhesive agent in a tape BGA (Ball Grid Array) or &mgr;-BGA (trade name) package, in which embedding and adhesion to copper patterns on circuit boards are excellent, in which feeding and punching quality in the film state are superior, and which can reduce stress caused by thermal expansion difference between a circuit board and a reinforcing metal board or an IC chip. Adhesive film for electronic parts comprises a resin layer in which the dynamic modulus of elasticity at −30 to 125° C. is from 1 to 30 MPa and adhesive layers are coated on surfaces of the resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.