Method of manufacturing wire bond pad
US6426284B1 · kind B1 · utility
0Cited by
17References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Mar 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond pad in an electrical circuit device package and method therefor including forming an opening in a conductor of a first electrically conductive material, forming a conducting member of a second electrically conductive material, transferring the conducting member into the opening of the conductor, electrically contacting the conducting member with the conductor, and embedding conductor with the conducting member in the opening thereof in an insulating electrical circuit device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.