Optical apparatus and method for shrinking heat shrink tubing, fusing wires and solder and unsolder packaged electronic components
US6426486B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Jun 16, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Optical heat-generating apparatus and methods that rapidly, controllably deliver energy (heat) to heat shrink tubing disposed over wires or other components and that may be used to fuse insulated wires together, and solder and unsolder packaged IC chips. In general, the apparatus comprises a housing having one or more reflective cavities that each comprise a linear elliptical reflective surface having first and second focal lines, and into which the heatable component is inserted and disposed along the first focal line. One or more optical heat-generating elements are disposed along the second focal line of each respective linear elliptical reflective surface that emit energy that is focused by the one or more linear elliptical reflective surfaces onto the heatable component disposed along the first focal line. A number of different embodiments of the apparatus have been developed. Lengths of heat shrink tubing may be readily shrunk using various embodiments of the present invention in less than one second.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.