Patent · US Expired

Structured packing for heat exchange and mass transfer

US6427985B1 · kind B1 · utility

20Cited by
12References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 25, 2000
Grant dateAug 6, 2002
Priority date
Expiry dateJul 25, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S261/72
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A structured packing for heat exchange and mass transfer between a liquid and a gas in a column having at least one packing layer with a first, lower end and a second, upper end is described, the packing layer having an internal geometry which varies over its height so that by suitably setting the liquid and gas flow rates in a first, in particular lower, region of the packing layer a bubbling layer having a predominantly disperse gas phase forms in a targeted manner and simultaneously in a second, in particular upper, region of the packing layer a film flow of the liquid having a predominantly continuous gas phase forms in a targeted manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.