Finishing element with finishing aids
US6428388B1 · kind B1 · utility
22Cited by
65References
51Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Aug 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface forming lubricating film. The organic lubricating film thickness can be controlled to improve finishing and reduce unwanted surface defects. Differential organic lubricating film methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer and organic lubricating film methods of finishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.