Method of polishing at least one surface of a silicon-based part
US6428395B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of polishing at least one surface of a silicon-based part made of SiO2, of SiC, of glass, of vitro-ceramic, or of quartz, the method comprising:a) a pre-polishing stage implementing at least one pre-polishing element and an abrasive, to confer a first roughness to said surface;b) a polishing stage implementing at least one polishing element and a liquid containing a polishing abrasive to confer to said surface a second roughness that is smaller than the first roughness;the method comprising:c) a finishing stage by soft abrasion implementing at least one finishing element, in particular a felt, and a soft abrasive, to remove a surface layer of sufficient thickness to improve the flux strength of the part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.