Wafer edge polishing method and apparatus
US6428397B1 · kind B1 · utility
6Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Feb 21, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contact between the wheel and the wafer. The wheel (16) is preferably rocked or oscillated laterally such that a constant polishing force is alternatively applied to each flank of the wafer (12). The wheel may be mounted in a buffer store to which the wafers are transported from a grinding station which grinds the edge flanks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.