Polishing composition and polishing method employing it
US6428721B1 · kind B1 · utility
44Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising the following components:(a) an abrasive,(b) &agr;-alanine,(c) hydrogen peroxide, and(d) water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.