Apparatus and method for improving circuit board solder
US6429383B1 · kind B1 · utility
28Cited by
9References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1999 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Apr 14, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes electrical interconnect mounting pads for mounting electronic devices thereto. Some of the electrical interconnect mounting pads include a plated through hole which traverses through the circuit board. One end of the plated through holes is closed, plugged or covered to prevent migration of solder through the plated through holes during a solder operation. The reduction in solder migration, as a result of plugging the plated through hole, increases solder joint quality over solder joint quality achieved using plated through holes which are not closed at one end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.