Patent · US Expired

Conductive polymer device and method of manufacturing same

US6429533B1 · kind B1 · utility

27Cited by
110References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 23, 1999
Grant dateAug 6, 2002
Priority date
Expiry dateNov 23, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01C7/021
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer sandwiched between a second internal metal foil electrode and a second external metal foil electrode, a layer of fiber-reinforced epoxy resin bonding the first and second internal electrodes together, a first terminal providing electrical contact between the first internal electrode and the second external electrode, and a second terminal providing electrical contact between the second internal electrode and the first external electrode. In a preferred embodiment, the polymer layers exhibit PTC behavior, and the terminals are formed by a solder layer applied over a plated layer of conductive metal. Insulative layers are preferably provided on the external electrodes, and located so as to insulate the first and second terminals from each other. Thus configured, the first and second polymer layers are connected in parallel between the first and second terminals by the first and second internal electrodes and the first and second external electrodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.