Integrated circuit chip and method for fabricating the same
US6429535B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Feb 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an integrated circuit chip includes the steps of:(a) forming a circuit board unit with a die-receiving cavity, and a plurality of contact pads on a top surface of the circuit board unit;(b) forming a die having an upper surface provided with a plurality of solder pads;(c) placing the die in the die-receiving cavity such that the solder pads on the die are exposed;(d) wire-bonding the solder pads to the contact pads via conductive wires;(e) placing a lead frame on the circuit board unit, and connecting leads on the lead frame to corresponding ones of the contact pads via a conductive contact layer; and(f) forming a plastic protective layer to encapsulate the circuit board unit and at least a portion of the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.