Low-loss electrode structures for optical modulation applications
US6429959B1 · kind B1 · utility
8Cited by
8References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Feb 8, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0356
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected on a surface of the optical modulator chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.