Techniques for cooling a circuit board component
US6430052B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | May 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly has (i) a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material, (ii) a support assembly that supports the circuit board, and (iii) a heatsink that cools the circuit board component mounted to the circuit board. The heatsink includes a receptacle that fastens to the support assembly, and an adjustable member that engages with the receptacle. The adjustable member is movable relative to the receptacle in order to control a distance between the adjustable member and the circuit board component. The adjustable member can be positioned properly (e.g., with the correct pressure) for proper heat transfer therethrough. Moreover, circuit board assembly can include multiple heatsinks for cooling multiple circuit board components with the adjustable member of each heatsink being individually adjusted to accommodate any tolerance differences between the circuit board components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.