Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6430109B1 · kind B1 · utility
128Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Sep 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is described a cMUT array with transducer elements which include a plurality of cells with membranes formed on one surface of a wafer. Voltages applied between said spaced electrodes drive said membranes. The voltages applied to said electrodes are applied from the opposite surface of the wafer through the wafer and through vias formed in the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.