Mechanical scribing methods of forming a patterned metal layer in an electronic device
US6430810B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1998 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0385
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention pertains to methods of forming a patterned metal layer in an electronic device, wherein the metal layer is in contact with an underlying organic polymeric layer (e.g., a conductive or semiconductive organic polymeric layer), which methods comprise mechanically scribing the metal layer with a mechanical scribing instrument to form the patterned metal electrode. More specifically, this invention pertains to methods of forming a patterned metal layer in an electronic device, which device comprises, in contact sequence, a support layer, an organic polymeric layer, and said metal layer, said method comprising the step of mechanically scribing said metal layer with a mechanical scribing instrument to form said patterned metal layer; wherein said mechanical scribing instrument scribes through the entire thickness of said metal layer; wherein said mechanical scribing instrument scribes through none, some, or all of the thickness of said organic polymeric layer; wherein said mechanical scribing instrument scribes through none or some, but not all, of the thickness of said support layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.