Patent · US Expired

Method of packaging a thermoplastic composition with a film having a low complex viscosity and corresponding packaged article

US6430898B1 · kind B1 · utility

21Cited by
10References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 21, 1999
Grant dateAug 13, 2002
Priority date
Expiry dateDec 21, 2019

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29K2105/0097
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The present inventors have discovered that an easily measured property, namely complex viscosity, directly relates to physical film compatibility and have further identified a class of polyolefin materials, which are particularly amenable to exhibiting such properties. It is important to note that this discovery assumes that the film material is first chemically compatible with the thermoplastic composition to be packaged.The invention is particularly useful for low viscosity thermoplastic compositions having a Brookfield viscosity of less than about 10,000 cPs at 350° F., such as pressure sensitive hot melt adhesive compositions which are typically applied by melting the packaged adhesive composition in a melt tank wherein the melt tank lacks an active mixing means. The invention is also useful for hot melt adhesives that are applied by application means that are very sensitive to inhomogeneity of the combination of molten hot melt adhesive and molten packaging material such as spraying, screen printing, foaming and gravure coating hot melt application techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.