Spring clip for fixing semiconductor modules to a heat sink

US6431259B1 · kind B1 · utility

Assignee

• EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE

Inventors

• Horst Hellbrück · Warstein, DE
• Ralf Jörke · Warstein, DE
• Konstantin Kanelis · Hersbruck, DE
• Manfred Loddenkotter · Ibbenbüren, DE
• Thilo Stolze · Arnsberg, DE

Key dates

• Filing date: Feb 26, 2001
• Grant date: Aug 13, 2002
• Expiry date: Feb 26, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.