Conductive trace interconnection
US6431876B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Oct 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of connecting a first conductive device to a second conductive device is provided. The first conductive device has a first conductive trace supported by a first substrate. The first trace has a generally planar first surface spaced away from the first substrate that defines a first edge. The second conductive device has a second conductive trace supported by a second substrate. The second trace has a generally planar second surface spaced away from the second substrate that defines a second edge. The method includes joining the first edge of the first trace with the second trace to form an area of contact such that a portion of the first surface proximate the area of contact is non-parallel with a portion of the second surface proximate the area of contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.