Grounding scheme for a high speed backplane connector system
US6431914B1 · kind B1 · utility
177Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2001 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Jun 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/514
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modular electrical connector comprising a plurality of wafers and shielding plates, each wafer having an insulative housing and a plurality of contact elements extending therethrough, the wafer having two side surfaces with slots formed therethrough to isolate each adjacent pair of contact elements within the wafer, each shielding plate having a plurality of ribs extending outwardly from at least one of two side surfaces thereof and being mounted between two adjacent wafers with each rib fitted within a corresponding slot to shield each adjacent pair of contact elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.