Patent · US Expired

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

US6432745B1 · kind B1 · utility

9Cited by

9References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Guenther Waitl · Regensburg, DE
Franz Schellhorn · Regensburg, DE
Herbert Brunner · Sinzing, DE

Key dates

Filing date	May 30, 1997
Grant date	Aug 13, 2002
Priority date	—
Expiry date	Dec 10, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.