Off-concentric polishing system design
US6432823B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1999 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Nov 4, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B27/0076
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.