Hot melt pressure sensitive adhesive which exhibits minimal staining
US6433069B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Jun 14, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2883
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a removable grade hot melt pressure sensitive adhesive comprising from about 5% to about 30% by weight of the adhesive of a block copolymer having styrene endblocks and ethylene/butylene or ethylene/propylene midblocks and having a coupling efficiency of less than about 65% and a melt index of greater than about 20 grams/10 minutes; from about 10% to about 50% by weight of the adhesive of at least one block copolymer having styrene endblocks and a coupling efficiency from about 65% to about 100%; from about 20% to about 60% by weight of the adhesive of a tackifying resin and from about 10% to about 40% by weight of the adhesive of a liquid plasticizing oil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.